Objective: To provide optimized cooling management to keep all temperature within limits.
Based on the total power calculate the flow required for the system to cool.
Collect inputs: power details, datasheets. Start building the detailed model in CFD tool (Icepak) from CAD model or rough placement layout.
Major modeling components include
Processor, DIMMS, Chipsets, HDD
Enclosure with % openings for front bezel and rear.
Power supply (resistance block with % loss from datasheet)
Fans selection (based on CFM requirements, power budget for fans, Redundancy, FRU)
PCI cards.
Based on the temperature (hot spots) & flow distribution, suggest various thermal solutions
Heat sink for CPU
Fan placement and baffling, usually dedicated/baffled fans for CPU.
More CFM fans if required for CPU’s
Spreader’s for DIMMS, heat sinks for chipsets.
Front and rear vent improvement for better flow.
Heat sink optimization. Fan failure cases.
System flow impedance.
